Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness. Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions. BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field. 10+ years of semiconductor package development experience.

Strong expertise in:

Multi-Phase Power Modules, DrMOS, and SPS packaging Advanced substrate design and manufacturing Flip-chip assembly and package integration Passive component assembly and optimization Thermal management and reliability engineering High-volume manufacturing and NPI processes Experience working with OSATs, substrate suppliers, and material vendors. Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers. Proficiency in engineering tools and methodologies, including

ACAD, 8D, SPC, DFMEA, DOE.

Proven ability to lead projects across organizations and cultures in a fast-paced environment. onsemi is excited to share the base salary range for this position is $150,000.00 to $249,780.00. The Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package.

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//www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf Lead package development from concept through production release. Define package architecture, materials selection, and assembly process flow. Develop and optimize substrate designs including stack-up, routing, power planes, via structures, and thermal features. Drive flip-chip integration, bump design, underfill selection, and assembly process optimization. Develop passive component integration strategies for capacitors, resistors, and magnetic components. Perform electrical, thermal, and mechanical performance optimization. Lead package qualification and reliability testing per JEDEC and IPC standards. Conduct root cause analysis and implement corrective actions for package failures. Collaborate with OSATs and suppliers on DFM, process development, yield improvement, and cost reduction. Support NPI execution and transfer technologies into high-volume manufacturing.