Senior Member of the Technical Staff to support the development and qualification of silicon carbide (SiC) MOSFETs. This position will report directly to the Chief Technology Officer of the Silicon Carbide Power Division. They will work closely with multiple teams across the organization during the design and development stage to ensure that new technologies meet automotive-grade reliability requirements with high production yields with reduced manufacturing costs. A primary focus of this role is to ensure the reliability of the SiC MOSFETs as they are deployed in advanced packages developed at customers for their unique requirements. B.S., M.S. or Ph.D. in Chemical Engineering, Electrical Engineering, Material Science or closely related discipline 10+ years of experience in semiconductor development or manufacturing 5+ years of experience in the development and qualification of discrete power components Experience in silicon carbide strongly preferred Extensive experience with process integration and reliability issues Experience in working with cross-functional engineering teams with matrixed responsibility for new product qualifications Excellent analytical, organizational, planning, and problem-solving/troubleshooting skills Comfortable in a fast-paced engineering and manufacturing environment Well-developed interpersonal and communication skills, including presenting and explaining technical issues to executive management Able to travel internationally 3-4 times per year Primary responsibilities Coordinate with all groups within the SiC Technology Development team to qualify new technology nodes in silicon carbide power devices across all package and module platforms Identify key areas of reliability concern based on customer inputs and mission profiles Collect inputs on key failures from internal stakeholders, customer feedback and internal reliability testing Develop reliability test method ("beyond-JEDEC") to quantify the impact of design/process changes on the reliability in customer-relevant conditions Project scope will include co-development with backend Packaging Engineering team to enable qualifications across all package and module platforms Prepare collateral to communicate reliability status/projections to internal team and customers International travel is required to support customers and the onsemi global manufacturing footprint