Hybrid Microelectronics Assembly Operator Accelera - 3.5 Lawrence, MA Job Details Full-time $19.95 - $26.40 an hour 21 hours ago Qualifications Cable assembly Assembly wiring Soldering tools Microscope proficiency Optical microscopy Technical Proficiency Electrical soldering Full Job Description Our microelectronics production group is looking for a Hybrid Operator to collaborate with our Senior Hybrid Operator. If you possess a strong technical foundation and are eager to advance your skills by working on sophisticated, high-reliability projects for sectors like medical devices, defense, and aerospace, this position is an excellent fit. Core Duties Execute die attach tasks using eutectic or epoxy techniques on hybrid circuits and ceramic substrates, receiving mentorship from senior team members for intricate assemblies. Complete gold or aluminum wedge and ball wire bonding processes to meet MIL-STD-883 or comparable quality benchmarks. Install fly wires and perform tack bonding or staking to ensure reliable circuit interconnects. Utilize microscope equipment to solder leads, fine-pitch components, and various interconnects. Support or conduct lid sealing procedures, including solder, parallel seam, or seam welding, while under guidance. Help ensure product quality by performing visual inspections throughout the process according to MIL and IPC standards. Analyze assembly drawings, work instructions, and schematics to guide production tasks. Document production travelers accurately to help maintain complete manufacturing traceability. Identify and report process challenges to the Senior Operator to assist in effective troubleshooting. Help maintain a safe working environment for the entire team by keeping your ESD-safe station clean and following all safety guidelines. Essential Qualifications Possess between two and five years of practical experience within the hybrid microelectronics assembly field. Demonstrate technical proficiency in wire bonding, die attach, and tack or fly wire assembly techniques. Show familiarity with lid seal and soldering processes, though independent mastery is not strictly required. Maintain a working knowledge of industry standards such as IPC-A-610, J-STD-001, or

MIL-STD-883.

Demonstrate the physical capability to perform tasks under high magnification for long durations. Exhibit exceptional manual dexterity and a keen eye for detail to ensure high-quality output. Show a proactive attitude toward receiving guidance and learning from senior technical personnel. Desired Qualifications Hold current IPC certifications or be actively pursuing them. Bring relevant experience or educational background in defense or government contract manufacturing. Have a history of working within controlled environments or cleanroom settings. Physical Demands Maintain the ability to remain seated for long periods while performing precise microscope work. Utilize fine motor skills to manage delicate and high-precision assembly tasks. Required Proficiencies Die Attach and Bonding expertise Microscope operation skills Wirebonding technical ability