Technician Specialist II - Focal Plane Packaging

BAE Systems

•

Boulder, Colorado

•

PERMANENT

REMOTE/WORK

FROM HOME

Updated 09/06/2026

Job Description

Job Summary

Job Description

We are seeking a Focal Plane Packaging Technician to apply microelectronics assembly skills to build custom focal planes and prototype hardware. This is a dynamic, hands‑on role working across a wide range of detector technologies, including ultraviolet, visible, near‑infrared, short‑wave infrared, mid‑wave infrared, and long‑wave infrared architectures. Your contributions will directly enable mission‑critical capabilities for Civil, Defense, and Tactical customers.

This position is part of the Detector Technology Center within the Payload Engineering department of the Engineering, Science and Analysis (ESA) Strategic Capabilities Unit at BAE Systems Space & Mission Systems (SMS). The ESA organization brings together the technical expertise and leadership needed to deliver high‑impact, discriminating technologies with a commitment to innovation, integrity, continuous learning, and disciplined execution.

The Engineering, Science and Analysis (ESA) Strategic Capabilities Unit comprises the technical talent and organizational leadership that enables the successful delivery of high-impact discriminating technologies for our customers' missions. Our collaborative, cross-functional teams are committed to innovation, integrity, continual learning and strong execution.

What You'll Do:

Play a key role in assembling and packaging custom focal planes and prototype hardware as part of a multidisciplinary team of technicians and engineers.

Assemble custom hybrids, focal plane assemblies, and prototype detector hardware in a cleanroom environment, working both independently and in small teams.

Perform a broad range of hands on microelectronics and precision assembly tasks, including mechanical assembly, staking and potting, critical cleaning, optical element alignment, optical bonding, precap inspections, device level inspections, and work to NASA soldering standards.

Participate in team meetings to plan processing operations, coordinate workflow, and support investigations into hardware anomalies.

Maintain a regular and predictable work schedule.

Establish and maintain effective working relationships within the department, the Strategic Business Units, Strategic Capabilities Units and the Company. Interact appropriately with others in order to maintain a positive and productive work environment.

Perform other duties as necessary.

On-Site Work Environment:

This position requires regular in-person engagement by working on-site five days each normally scheduled week in the primary work location. Travel and local commute between company campuses and other possible non-company locations may be required.

Working Conditions:

Work is performed in an office environment, laboratory, cleanroom, or production floor.

Requirements

Required Education, Experience, & Skills

High School diploma or equivalent plus 4 years or more related experience.

Each higher-level related degree, i.e., Bachelor's or Master's, may substitute for two years of related experience. Degree must be from a university, college, or school which is accredited by an agency recognized by the US Secretary of Education, US Department of Education.

Experience in microelectronic, hermetic, or open‑package assembly of custom hybrids (MCMs) or focal plane imaging devices.

Ability to obtain company certifications for cleanroom operations, handling electrostatic‑sensitive components, and national electronic assembly standards such as NASA J‑STD and MIL‑STD‑883.

Excellent organizational skills, including planning, documentation, and clear communication.

Proficiency performing inspections and assembly tasks using microscopes.

#LI-GJ1

Preferred Education, Experience, & Skills

Previous experience working in a Class‑100 cleanroom.

Experience working in an R D or low‑volume/high‑value production environment.

Experience in aerospace, optical, or medical device R D or production environments.

Experience in several of the following processing technologies:

Semiconductor die attach.

Precision optical assembly.

Wire‑bonding and ribbon‑bonding.

Soldering and surface‑mount technology.

Critical cleaning and contamination control.

Detailed visual inspection (including microscope work).

Hermetic seam‑sealing.

Mechanical assembly, including alignment and torque‑controlled operations.

Adhesive application and curing.

Vacuum processing.

Pay Information

Full-Time Salary Range:

$75998 - $121597

Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.

Employee Benefits:

At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20+ hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.

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