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PLS Staffing
Supervisor Microelectronics Assembly
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Job Description
Jobs › Lawrence, MA › Supervisor Microelectronics Assemb… PLS Staffing Supervisor Microelectronics Assembly Lawrence, MA Apply Lead/Supervisor Microelectronic Assembly Operator Key Responsibilities
- Perform die attach operations (epoxy, eutectic, and/or solder methods) on ceramic substrates and hybrid circuits
- Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards
- Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects
- Solder fine-pitch components, leads, and interconnects under microscope
- Perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) ensuring hermeticity
- Conduct in-process visual inspections per IPC/MIL specifications
- Read and interpret schematics, assembly drawings, and work instructions
- Maintain accurate documentation/travelers for traceability
- Troubleshoot assembly issues and recommend process improvements
- Maintain a clean, ESD-safe workstation and comply with all safety protocols Required Qualifications
- 5-10 years of hands-on experience in hybrid microelectronics assembly
- Demonstrated proficiency in die attach, wire bonding, fly wire/tack wire, soldering, and lid sealing
- Experience working to MIL-STD-883, J-STD-001, or
IPC-A-610
standards (or equivalent)- Ability to work under high magnification (microscope) for extended periods
- Strong attention to detail and manual dexterity
- Familiarity with hermeticity testing (fine/gross leak) a plus Preferred Qualifications
- IPC certification(s)
- Experience with government/defense contract manufacturing
- Prior experience in a cleanroom or controlled environment Physical Requirements
- Ability to sit for extended periods while working under a microscope
- Fine motor control for precision assembly work Key Responsibilities
- Perform die attach operations (epoxy, eutectic, and/or solder methods) on ceramic substrates and hybrid circuits
- Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards
- Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects
- Solder fine-pitch components, leads, and interconnects under microscope
- Perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) ensuring hermeticity
- Conduct in-process visual inspections per IPC/MIL specifications
- Read and interpret schematics, assembly drawings, and work instructions
- Maintain accurate documentation/travelers for traceability
- Troubleshoot assembly issues and recommend process improvements
- Maintain a clean, ESD-safe workstation and comply with all safety protocols Required Qualifications
- 5-10 years of hands-on experience in hybrid microelectronics assembly
- Demonstrated proficiency in die attach, wire bonding, fly wire/tack wire, soldering, and lid sealing
- Experience working to MIL-STD-883, J-STD-001, or
IPC-A-610
standards (or equivalent)- Ability to work under high magnification (microscope) for extended periods
- Strong attention to detail and manual dexterity
- Familiarity with hermeticity testing (fine/gross leak) a plus Preferred Qualifications
- IPC certification(s)
- Experience with government/defense contract manufacturing
- Prior experience in a cleanroom or controlled environment Physical Requirements
- Ability to sit for extended periods while working under a microscope
- Fine motor control for precision assembly work Temp to Perm and open to Direct Hire for the right candidate Active Filters Supervisor Microelectronics Asse.