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Jobs › Lawrence, MA › Supervisor Microelectronics Assemb… PLS Staffing Supervisor Microelectronics Assembly Lawrence, MA Apply Lead/Supervisor Microelectronic Assembly Operator Key Responsibilities

• Perform die attach operations (epoxy, eutectic, and/or solder methods) on ceramic substrates and hybrid circuits
• Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards
• Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects
• Solder fine-pitch components, leads, and interconnects under microscope
• Perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) ensuring hermeticity
• Conduct in-process visual inspections per IPC/MIL specifications
• Read and interpret schematics, assembly drawings, and work instructions
• Maintain accurate documentation/travelers for traceability
• Troubleshoot assembly issues and recommend process improvements
• Maintain a clean, ESD-safe workstation and comply with all safety protocols Required Qualifications
• 5-10 years of hands-on experience in hybrid microelectronics assembly
• Demonstrated proficiency in die attach, wire bonding, fly wire/tack wire, soldering, and lid sealing
• Experience working to MIL-STD-883, J-STD-001, or

IPC-A-610

standards (or equivalent)

• Ability to work under high magnification (microscope) for extended periods
• Strong attention to detail and manual dexterity
• Familiarity with hermeticity testing (fine/gross leak) a plus Preferred Qualifications
• IPC certification(s)
• Experience with government/defense contract manufacturing
• Prior experience in a cleanroom or controlled environment Physical Requirements
• Ability to sit for extended periods while working under a microscope
• Fine motor control for precision assembly work Key Responsibilities
• Perform die attach operations (epoxy, eutectic, and/or solder methods) on ceramic substrates and hybrid circuits
• Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent standards
• Perform fly wire (jumper wire) installation and tack wire bonding/staking for circuit interconnects
• Solder fine-pitch components, leads, and interconnects under microscope
• Perform lid seal operations (seam seal, parallel seam welding, and/or solder seal) ensuring hermeticity
• Conduct in-process visual inspections per IPC/MIL specifications
• Read and interpret schematics, assembly drawings, and work instructions
• Maintain accurate documentation/travelers for traceability
• Troubleshoot assembly issues and recommend process improvements
• Maintain a clean, ESD-safe workstation and comply with all safety protocols Required Qualifications
• 5-10 years of hands-on experience in hybrid microelectronics assembly
• Demonstrated proficiency in die attach, wire bonding, fly wire/tack wire, soldering, and lid sealing
• Experience working to MIL-STD-883, J-STD-001, or

IPC-A-610

standards (or equivalent)

• Ability to work under high magnification (microscope) for extended periods
• Strong attention to detail and manual dexterity
• Familiarity with hermeticity testing (fine/gross leak) a plus Preferred Qualifications
• IPC certification(s)
• Experience with government/defense contract manufacturing
• Prior experience in a cleanroom or controlled environment Physical Requirements
• Ability to sit for extended periods while working under a microscope
• Fine motor control for precision assembly work Temp to Perm and open to Direct Hire for the right candidate Active Filters Supervisor Microelectronics Asse.

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