Semiconductor Packaging Engineer

Job Description An Insight Global client in Tucson, AZ is seeking a packaging engineer who comes from a process engineering background to join their team. This person will be responsible for process improvements to the company's wire/die bonding, oven vacuum and pick and place machine manufacturing process. The team currently has the front end of the process automated, but the backend is not currently automated

• therefore a background and experience in setting up automated systems is critical as the team explores further automation.

This person must have strong experience in Lean Six Sigma principles, root cause analysis, continuous improvement, and process SPC . This role does require the employee to be in-person in Tucson, AZ, but there is some day-to-day schedule flexibility as long as the job is getting completed. This role can pay between $90k and $100k and relocation assistance can be offered on a case-by-case basis. Exact compensation may vary based on education and experience. We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.

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https://insightglobal.com/workforce-privacy-policy/. Skills and Requirements Required knowledge, skills, and experiences:

• Bachelor's degree or master's degree in electrical or mechanical engineering.
• Semiconductor packaging experience including laser assembly, wire bonding, and cleanroom work
• Strong data analysis skills using

SPC , DOE

, and other tools to improve yield and quality

• Experience with MES systems (specifically pick and place vision systems) and working with IT to improve manufacturing data and processes
• Leadership and teamwork abilities to guide cross-functional teams and manage new product introductions
• Process improvement knowledge using Lean, Six Sigma, and layout design to boost efficiency and reduce waste To view full details and how to apply, please login or create a Job Seeker account