Job Summary Staff level engineer working in a fast paced team environment will be directly involved with development and production of electronic packaging processes used in commercial, automotive and other specialty products for hyperscalers. Responsibilities will include characterization and qualification of processes and equipment for the manufacture of industry leading advanced power component solutions then transitioning and supporting those processes in production.

Job Description

• Will work with enabling technologies such as transfer molding and precision automated grinding.
• Develops cost effective electronics packaging improvements to existing methods and leads efforts in solutions for new products.
• Writes technical reports and prepares presentations for peer review covering process development activities and next generation processing methods to supporting technologies that our customers use in application such as cloud servers, autonomous vehicles, military and industrial equipment.
• Hands on responsibility for equipment including programming and the SPC needed to ensure the highest yields, throughput, and lowest cost.
• Implement and manage real time SPC and utilize Six Sigma tools such as PFMEAs to implement meaningful process controls
• Supports the organizational goal of Automotive Readiness in preparation for

IATF 16949

Certification.

• Work independently as well as lead cross-functional development teams.
• Monitor line performance and take corrective action to eliminate process problems and improve yields. 
• Work with Design, Test, and Quality Engineering to implement yield and quality enhancements
• Work with hourly production and maintenance personnel to improve line performance
• Review all new product designs for compatibility with process capability. Make appropriate recommendations on new designs.
• Identify and lead cost reduction and quality improvement initiatives 
• Initiate and approve manufacturing documentation and ECO's
• Investigate problems, determine root cause, and implement corrective and preventative actions
• Expected to be hands on with equipment, including occasional maintenance and troubleshootingEducation / Qualifications
• Bachelor's Degree in Mechanical, Chemical, Plastics, or Manufacturing Engineering. Master's degree is a plus. 
• Minimum of 3 - 5 years of experience with electronics packaging and/or manufacturing.
• Experience with the Automotive Requirements such as

IATF 16949

Certification, PPAP, BIQ, FTQ considered a plus.

• Experience using design based software systems. Examples include Solid Works, Pro Engineer, or Auto CAD. Moldflow experience preferred.
• Knowledge of transfer or injection molding manufacturing.
• Sound fundaments and understanding of materials engineering and associated properties of materials.
• Good hands on engineering skills and ability to work on production equipment 
• Solid skills in problem solving and statistics
• Ability to understand, analyze, and resolve moderately complex technical problems
• Ability to work independently and be effective in a fast paced environment
• Excellent writing and organizational skills All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability or protected veteran status.

Vicor is an EO employer - M/F/Veteran/DisabilityCompensation Data

Salary Range:

$95,000 - $115,000 Please note: This range is based on our current market driven pay structures. Individual salaries are determined based upon a variety of factors including but not limited to, a candidates overall qualifications, such as skills, education, and experience as well as company internal equity.