Electronics Cooling Simulation Engineer

Role Overview We are seeking an individual contributor to own and collaborate on thermal, fluid dynamics, electrical, and mechanical simulations across a range of datacenter scenarios. This role spans multiple scales—from chip/package-level modeling to board- and rack-level system analysis—and directly informs design decisions through validated simulation workflows. Key Responsibilities Develop and execute thermal, fluid dynamics, electrical, and mechanical simulations for datacenter hardware (e.g., fan-cooled GPU systems, liquid-cooled platforms) Build multiphysics models covering chip/package, board, and rack-level systems Collaborate closely with test and validation teams to correlate simulation results with experimental data Generate validated models to guide the design of experiments (DOE) and system optimization Contribute to cross-functional efforts involving mechanical, electrical, and system design Support design decisions related to cooling architectures (air and liquid) Required Qualifications 3-5 years of experience in thermal and fluid dynamics simulation B.S. in Mechanical Engineering, Electrical Engineering, or a related field Hands-on experience with CFD tools (e.g., ANSYS IcePak, Fluent) Experience with conjugate heat transfer and electronics cooling Proficiency in Python for simulation automation, data processing, or workflow development

Pay:

$110,000.00 - $130,000.00 per year

Benefits:

401(k) Flexible schedule Health insurance Health savings account Retirement plan

Education:

Bachelor's (Preferred)

Work Location:

Hybrid remote in Newark, CA 94560