An Integrated Circuit (IC) Design Engineer designs and develops integrated circuits used in electronic devices and communications systems. Designs circuitry and builds circuitry frameworks for products and systems.
We are seeking experienced IC Packaging Design Engineers to support advanced semiconductor packaging programs. The ideal candidates will possess strong expertise in package and substrate design, with hands-on experience in leading package design tools and a deep understanding of performance, manufacturability, and reliability considerations. Key Responsibilities Develop and implement physical design and layout solutions for advanced IC packages. Perform substrate design and package layout activities while ensuring adherence to design specifications. Execute signal integrity (SI) and power integrity (PI) aware package designs. Optimize package designs for performance, manufacturability, yield, reliability, and cost efficiency. Ensure compliance with package design rules, technology constraints, and industry standards. Collaborate with cross-functional teams including silicon, system, SI/PI, manufacturing, and reliability engineering teams. Support design reviews, issue resolution, and continuous process improvements throughout the product development lifecycle. Preferred Experience Candidates should demonstrate expertise in one or more of the following areas: Physical package design and layout. Substrate design and routing methodologies. SI/PI-aware package implementation. Design for manufacturability (DFM), design for reliability (DFR), and yield optimization. Package design rule verification and compliance. Advanced semiconductor packaging technologies, including multi-die, SiP, or high-performance package solutions. Qualifications Bachelor's or Master's degree in Electrical or Electronics Engineering.
Senior-Level:
10+ years of experience in IC packaging and package design.
Mid-Level:
4-6 years of experience with a Master's degree or 6+ years with a Bachelor's degree in IC packaging and package design. Strong communication skills and the ability to work effectively in a cross-functional engineering environment. Required Technical Skills Strong hands-on experience with Siemens (Mentor) Xpedition (XPD). Alternative experience with Cadence Allegro, Advanced Package Designer (APD), or SiP tools is also acceptable. Solid understanding of semiconductor packaging technologies, package architectures, and substrate design methodologies
