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Thin Film Module Engineer

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Semiconductor Components Industries, LLC

Hopewell Junction, NY (In Person)

$153,850 Salary, Full-Time

Posted 8 weeks ago (Updated 7 weeks ago) • Actively hiring

Expires 5/27/2026

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Job Description

onsemi is seeking a Thin Films Engineer. You will develop and support the manufacturing of 300mm silicon wafers used for Automotive and Consumer applications throughout the world. You will also provide process engineering support for additional process areas. In this team-based environment, you will work closely with integration, process and equipment teams to provide robust, quality products to our customers.
Qualifications Education:
BS degree in Engineering or a technical field. An MS degree is a plus
Experience:
7+ years in semiconductor processing or a similar industry Knowledge of CVD and PVD processes with a focus on AMAT and LAM equipment Experience working in cross-functional teams to achieve goals and metrics Experience with FMEA risk analysis is a plus Intermediate-level data analysis skills, specifically in Excel or JMP, using formulas, pivots, and charts, are required Proficiency in Microsoft Office, particularly PowerPoint Strong communication skills with experience in presenting technical project details Self-motivated and results-oriented Fluency (written and oral) in English required
Salary:
onsemi is excited to share the base salary range for this position is$114,000 to $193,700 exclusive of fringe benefits or potential bonuses.

The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package.
https:
//www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf Responsibilities Own critical CVD and PVD processes and associated health of AMAT and LAM equipment in a fast-paced, 24/7 manufacturing environment. Apply technical skills to implement equipment and process improvements that increase product performance, reduce cost, and increase throughput and yield. Design and document experiments utilizing engineering methodology to improve yield, cost, and throughput. Resolve complex, time-sensitive technical problems to maintain production or development schedules. As a Thin Films Engineer, you will be expected to make decisions using data analysis and statistical process control (SPC) techniques. Provide daily process and product lot disposition support in the furnace processing area. Contribute to the understanding and resolution of all equipment-level shifts in tool performance Within the first six to twelve months, develop advanced sustaining responsibilities and contribute to cost reduction, yield improvement, and production throughput increase.

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