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Semiconductor Components Industries, LLC

Principle WETS Module Engineer

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What they do

An Advanced Manufacturing Engineer coordinates and manages manufacturing processes in within a manufacturing environment. Develops and implements product quality standards, evaluates and improves manufacturing methods for maximum efficiency. Estimates resource requirements, production times and schedule for manufacturing processes.

$86,048 / year median in New York

+10% projected growth

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Job Description

onsemi is seeking a WETS Module Engineer at our EFK Hopewell Junction site. We are a leading innovator in semiconductor technology, dedicated to advancing power electronics through cutting‑edge research and development. We are seeking a talented and motivated Engineer to join our team. Provide technical leadership and strategic ownership of wet process technologies supporting 300mm wafer manufacturing for Automotive, Industrial, and Consumer applications. Drive process excellence, equipment performance, technology deployment, and yield improvement initiatives across the WETS module. Bachelor's degree in Engineering, Materials Science, Physics, or related discipline. 10+ years semiconductor manufacturing experience. 7+ years direct experience in Wet Process, Cleans, Wet Etch, or Module Engineering. Extensive experience with SCREEN, TEL and
SICONEXX
technologies. Technical Expertise SPC, DOE, FDC, Yield Analysis, RCA and FMEA. Process characterization and qualification methodologies. High-volume 300mm semiconductor manufacturing environments.
Salary:
onsemi is excited to share the base salary range for this position is $114,000 to $193,700 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package.
https:
//www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf Serve as SME for SCREEN, TEL, and
SICONEXX
platforms. Lead module-level yield, defect reduction, cost, and throughput improvements. Drive DOE, SPC, APC, FDC, and advanced data analytics initiatives. Lead root cause investigations and corrective actions for complex excursions. Develop qualification strategies for new processes, hardware upgrades and installations. Mentor engineers and provide cross-functional technical leadership.