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09 - Senior Lead Engineer, Manufacturing Process 1 1
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What they do
A Manufacturing Process Engineer develops workflow, work station, and equipment improvement recommendations within a company's manufacturing environment. Fine tunes manufacturing processes by researching, designing, modifying, and testing manufacturing methods and equipment. Evaluates manufacturing processes, applies knowledge of product design, fabrication, assembly, tooling, and material.
$98,450 / year median in Texas
+12% projected growth
Job Description
Req ID:
140336Region:
Americas Country:
USA State/Province:
Texas City:
Richardson General Overview Functional Area:
Engineering Career Stream:
Process Engineering Manufacturing SAP Short Name:
SLE-ENG-PRM
Job Level:
Level 09IC/MGR:
Individual Contributor Direct/Indirect Indicator:
Indirect Job Description Why Celestica? Celestica is changing the future! We are imagining, developing and delivering a better future with our customers. At Celestica, we foster a motivated, high-integrity work environment based on a strong set of corporate Values. These Values empower our employees to provide you with superior service. Relentless Curiosity We are obsessed with uncovering the information and insights that allow us to anticipate and overcome the challenges of the future. Bold Conviction We dare to envision new solutions, new technologies, new ways of working and invest to make it a reality. Unwavering Dedication We exemplify teamwork and commitment in every decision and every action to be the best partners to our customers and our colleagues. Detailed Description The Senior Lead Engineer- Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.
NPI-PCBA
ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM- Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.
DFX:
ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assemb;y (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills / Edgebonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal , Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe)FA LAB :
ESD Controls, Solder Metallurgy, Strain Gauge Analysis, SIR Testing, Solder Joint Reliability Modeling, Sample Prep (Grind and Polish), Dye & Pry, CMM/VMM, Lab X-Ray, Pull/Bend Testing, Vibration Testing, Drop Testing, TDR, XRF, SEM, FTIR, IC, Solderability Testing, Thermal Analysis, HALT/HASS, TH&B, Thermal Shock, ATCOPTICAL & XRAY INSPECTION
: ESD Controls, Auto Wire Prep, SMT Data Analytics, API, AOI (PCBA), AXI (PCBA), AOI (System), Test Strategy Creation, IPC-610, Quality Dat (KPI), DFM- Manufacturing, DFA
- Assembly, DFT / Physical Test, DFT
- Electrical Test
MACHINING & OTHER
: ESD Controls, Pack & Ship, CNC programming, Secondary Processing, Sheet Metal, Machining, Welding, DFM- Manufacturing
MECHANICAL & SYSTEMS ASSEMBLY
: ESD Controls, Wire Harness Assembly, Auto Wire Prep, Mechanical Assembly- System Build, OEE / Industrial Engineering, Pack & Ship, Vacuum System, Fluidics, Electrical Enclosure, Cable Routing, Electrical
- Automation, Mechanical
- Automation, Machine Vision, IPC-610, Engineering Controls, Quality Data (KPI), Manufacturing Operational Management, DFM
- Manufacturing, DFA
- Assembly, DFAA
- Automated Assembly, DFT
- Physical Test
PCBA ASSEMBLY
: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Manufacturing Operational management, DFM- Mfg, DFA, DFR, Customer specific processes.
MICROELECTRONICS
: ESD Controls, Wafer Thinning, Wafer Singulation, Edge Polishing, Optical Coatings, Die Bonding, Vacuum Reflow, Flip Chip Bonding, Underfill, Active Alignment, Plasma Cleaning, Wire Bonding, Encapsulation, Sealing, Leak Testing, Interconnect Formation Typical Experience 4 to 6 years in a similar role or industry. Project Management- Ability to manage/lead complex, multiple line engineering projects that may also involve other functions.
- Demonstrate "People & Team Leadership Behaviors" as per Celestica Leadership Imperatives. Financial Acumen / Business Planning
- Ability to create financial plans for your projects, align them internally with your line of management and other functions and externally if needed.