Wafer Fab Equipment Engineer
Job
Teledyne
Goleta, CA (In Person)
$132,500 Salary, Full-Time
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Job Description
- Be visionary
- Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability.
- Job Description
Job Summary:
- As part of the Uncooled Detector (Focal Plane Array) Low-Rate Production team, the Wafer Fab Equipment Engineer will be responsible for the ownership, reliability, and continuous improvement of wafer fabrication equipment supporting low‑rate manufacturing of infrared detector devices.
- This is an ideal position for a self‑directed, technically strong, and collaborative engineer who enjoys hands‑on equipment work, root‑cause problem solving, and operating in a structured cleanroom production environment. The work environment is a mix of office and cleanroom settings, within a collaborative, supportive, and engaging team culture.
Primary Duties & Responsibilities:
- + •Own and support assigned wafer fabrication tools and associated subsystems used in low-rate production•+ •Troubleshoot, diagnose, and resolve equipment issues impacting safety, yield, schedule, or throughput•+ •Drive equipment reliability improvements through root cause analysis and corrective/preventive actions•+ •Partner with Process Engineers to ensure tools meet process capability and control requirements•+ •Support hands•‑on wafer processing and recovery activities for production lots as needed•+ •Collect, analyze, and trend equipment performance metrics (OEE, Uptime, MTBF, MTTR, repeat failures)•+ •Improve equipment diagnostics, automation, and recovery procedures to reduce unplanned downtime•+ •Document equipment procedures, configurations, and workflows in MES•‑ready formats•+ •Ensure compliance with safety, cleanroom, and EHS requirements•+ •Collaborate with Process, Maintenance, Quality, and R D teams to support stable low-rate production execution•
Job Qualifications:
- + •Minimum Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline•+ •1-5 years of relevant experience supporting semiconductor, MEMS, or microfabrication equipment•+ •Familiarity with equipment metrics (MTBF, MTTR, OEE), SPC concepts, or structured escalation workflows•+ •Strong written and verbal communication skills in English•+ •Proficient computer skills, including JMP, Microsoft Word, Excel•+ •Strong troubleshooting, root•‑cause analysis, and problem•‑solving skills•+ •Ability to work hands•‑on with semiconductor fabrication equipment, including vacuum systems, RF plasma systems, motion control, and wet processing tools•+ •Experience with one or more key wafer fabrication processes•+ •Experience using basic inspection and diagnostic tools (e.
- + •Familiarity with cleanroom operations, safety practices, and controlled manufacturing environments•+ •Must be a U.
- Desired Background
- + •Exposure to infrared detectors, focal plane array, or imaging device fabrication•+ •Experience developing and executing preventive maintenance strategies•Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)•
Salary Range:
- $113,600.
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