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Thermal Engineering Liquid Cooling

Job

Piper Companies

Saratoga, CA (In Person)

$275,000 Salary, Full-Time

Posted 4 weeks ago (Updated 1 day ago) • Actively hiring

Expires 6/14/2026

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Job Description

Piper Companies is seeking a Thermal Engineering
  • Liquid Cooling specialist to support a leading organization in the high‑performance computing and advanced hardware systems industry. The Thermal Engineering
  • Liquid Cooling role is ideal for an experienced engineer with deep expertise in server‑class liquid cooling, cold plate design, and high‑volume production thermal solutions. Responsibilities of the Thermal Engineering
  • Liquid Cooling:
  • Lead liquid‑cooling development activities for server‑class compute systems from concept through high‑volume production.
  • Drive cold‑plate design, optimization, validation, and integration for next‑generation compute hardware.
  • Use thermal simulation tools such as Ansys Icepak (ideal), FloTHERM, FlowFD, or Fluent to model, analyze, and refine cooling solutions.
  • Collaborate with OSAT manufacturers to support thermal packaging, manufacturing readiness, and process alignment.
  • Work closely with global engineering teams, including Taiwan subcontractors, to ensure cooling requirements meet system, packaging, and reliability standards.
  • Support module‑level and system‑level thermal characterization and performance testing.
  • Apply deep thermal engineering knowledge to improve efficiency, reliability, and manufacturability of liquid‑cooled solutions. Qualifications of the Thermal Engineering
  • Liquid Cooling:
  • 5+ years of experience in liquid‑cooling thermal engineering for electronics, with a proven track record of bringing solutions from concept to high‑volume production.
  • Strong experience with liquid cooling for server‑class compute systems (not EV, automotive, or consumer electronics).
  • Deep knowledge and hands‑on experience with cold‑plate design.
  • Proficiency with thermal simulation tools: Ansys Icepak (ideal), FloTHERM, FlowFD, Fluent (acceptable), COMSOL (helpful but not primary).
  • Experience working with OSAT manufacturers on thermal or packaging‑related builds.
  • Ability to interface effectively with Taiwan subcontractors.
  • Familiarity with environments similar to advanced liquid‑cooled compute leaders (e.g., NVIDIA, Google, Meta, Tesla—compute/server divisions, IBM). Compensation for the Thermal Engineering
  • Liquid Cooling includes:
  • Salary range: $250,000
  • $300,000
  • Comprehensive benefits package including medical, dental, vision, 401(k), and PTO This job opens for applications on 04/17/2026.
Applications for this job will be accepted for at least 30 days from the posting date. #LI-JN1 #LI-ONSITE

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