The Product Repair & Failure Analysis Engineer is responsible for the complete troubleshooting, failure analysis, repair, restoration, and validation of electronic products throughout the manufacturing and product-return lifecycle. This position supports PCBAs, electronic subassemblies, cables and harnesses, mechanical assemblies, box-build products, finished goods, customer returns, and RMA units. Responsibilities extend from initial failure identification through product teardown/disassembly, electrical and mechanical troubleshooting, component-level repair, reassembly, retesting, root-cause analysis, and final disposition. The position is not limited to PCBA-level repair and is expected to investigate the complete product to determine the true root cause of failure. Key Responsibilities End-to-End Product Troubleshooting & Repair Diagnose failures across PCBAs, subassemblies, cables/harnesses, mechanical assemblies, box-build products, and finished goods using schematics, drawings, BOMs, test data, RMA information, and other technical documentation. Disassemble and tear down finished products as required to access internal assemblies, reproduce failures, and determine the true failure location. Perform component- and circuit-level troubleshooting of SMT and through-hole PCB assemblies and identify electrical, functional, mechanical, connection, workmanship, and assembly defects. Perform or oversee component replacement, BGA/QFN/QFP/fine-pitch rework, soldering, desoldering, jumper installation, trace/pad repair, cable/harness/PON replacement, connector repair, and other approved repair activities. Restore and reassemble repaired products in accordance with approved manufacturing and workmanship requirements. Determine whether failed products can be repaired, require additional engineering evaluation, should be returned to supplier/customer, or should be scrapped. Coordinate retest and final product validation after repair to confirm complete functional recovery before release. RMA, Failure Analysis & Engineering Support Lead or support technical investigation of RMA and customer-returned products, including failure reproduction, product teardown, repair feasibility, and technical disposition. Analyze recurring failures and repair trends across PCBA, subassembly, and finished-product levels to identify root causes and improvement opportunities. Work with Test, Process, Manufacturing, Quality, and customer engineering teams to distinguish product failures from process, test, assembly, or handling conditions. Participate in root-cause analysis, corrective/preventive action, 8D, CAPA, and customer failure investigations as required. Support engineering evaluations, prototype builds, NPI activities, production launches, and field-return investigations. Develop and validate repair, teardown, reassembly, and recovery procedures for recurring failure modes. Provide technical direction and support to Production, Quality, Repair Technicians, and other cross-functional teams. Quality, Validation & Compliance Interpret and apply

IPC-A-610

Acceptability of Electronic Assemblies requirements and applicable customer workmanship standards. Ensure repaired PCBAs, subassemblies, and finished products meet applicable IPC, customer, engineering, mechanical, and internal requirements. Verify that disassembly and repair activities do not introduce secondary damage and that products are correctly restored and reassembled. Document repair activities, RMA findings, failure modes, root causes, dispositions, and corrective actions accurately. Support internal and customer quality audits and provide technical evidence for product-failure investigations. Work with Test Engineering to confirm repaired products successfully complete applicable functional and final-product validation. Documentation & Continuous Improvement Maintain accurate repair records, RMA reports, failure-analysis reports, defect codes, teardown findings, and engineering documentation. Review repair and return data to identify trends and opportunities for reducing repeat failures, scrap, rework, and repair turnaround time. Develop and update repair instructions, RMA investigation methods, teardown/reassembly procedures, troubleshooting guides, and standard operating procedures.

Qualifications Experience:

5+ years in electronics manufacturing, product repair, failure analysis, RMA investigation, PCBA rework, or electronic troubleshooting. Experience troubleshooting complete electronic products and advanced SMT packages is preferred.

Education:

Associate degree in Electronics Engineering Technology, Electrical Engineering Technology, Manufacturing Engineering, Mechatronics, or a related field, or equivalent hands-on experience.

Technical Skills:

Strong understanding of electronic products, SMT/PCBA manufacturing, assembly, box-build, and product-repair processes. Experience troubleshooting complete electronic assemblies from finished-product level down to component and circuit level. Ability to read schematics, PCB layouts, assembly/mechanical drawings, BOMs, work instructions, test results, and product specifications. Working knowledge of product teardown/reassembly, soldering, electronic rework, cable/harness repair, connectors, and mechanical integration. Ability to use digital multimeters, oscilloscopes, power supplies, and related diagnostic equipment to isolate failures. IPC-A-610 and

IPC J-STD-001

certification or demonstrated experience preferred.

IPC-7711/7721

rework and repair experience preferred; RMA/failure-analysis experience strongly preferred.

Soft Skills:

Strong analytical, problem-solving, and communication skills. Ability to work effectively with Production, Quality, Engineering, and other cross-functional teams. Proficiency in Microsoft Office and engineering data analysis tools.

Other:

Bilingual English/Mandarin preferred.

Benefits:

401(k) 401(k) matching Dental insurance Disability insurance Employee assistance program Flexible spending account Health insurance Health savings account Life insurance Paid time off Vision insurance People with a criminal record are encouraged to apply Application Question(s): Will you now, or in the future, require sponsorship for employment visa status (e.g. H-1B visa status)?

Work Location:

In person