Senior Thermal-Mechanical Engineer - Aerospace Communications & Space Electronics NOKIA United States, Texas, Plano 6600 Chase Oaks Boulevard (Show on map) Aug 26, 2026 The Senior Thermal-Mechanical Engineer will play a crucial role in our team, leading the development and integration of aerospace and space communications equipment. With a primary focus on RF communications, this role involves designing thermal-mechanical solutions for high-performance electronics, including SpaceVPX/VITA-based systems. The successful candidate will have extensive experience in thermal management, structural analysis, and environmental qualification, ensuring our equipment meets the demanding requirements of aerospace and space environments. Lead thermal-mechanical architecture and detailed design for aerospace communications equipment, with a focus on RF systems.
Design thermal management solutions for high-power RF amplifiers, processors, and other high-density electronics.
Develop mechanical packaging and thermal solutions for SpaceVPX and VNX-based systems, ensuring optimal performance and reliability.
Perform thermal, structural, and thermo-mechanical analysis, including steady-state and transient thermal analysis, and modal analysis.
Design and optimize heat sinks, cold plates, and thermal interface materials to enhance heat dissipation.
Work closely with multidisciplinary engineering teams, including RF, electrical, and systems engineers, to ensure seamless integration.
Lead and support TVAC, shock, and vibration qualification testing, ensuring our equipment meets the highest standards.
Take ownership of hardware development, from concept to production, ensuring timely and successful project delivery.
Mentor junior engineers and provide technical leadership, fostering a culture of continuous improvement.
Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or a related field is required.
7+ years of relevant thermal-mechanical or mechanical engineering experience, with a strong focus on aerospace or space applications.
Expertise in thermal management of electronic, RF, and communications equipment is essential.
Hands-on experience with SpaceVPX, VNX, and VPX architectures is highly desirable.
Proficiency in FEA and thermal analysis tools, such as ANSYS or Abaqus, is a must.
Demonstrated experience in TVAC, thermal cycling, shock, and vibration qualification testing.
Strong understanding of mechanical packaging, GD&T, and manufacturing processes.
Ability to work effectively in a multidisciplinary team, collaborating with RF, electrical, and systems engineers.
Excellent problem-solving and analytical skills, with a track record of delivering complex engineering projects.
U.S. Citizenship or Permanent Residency (Green Card) is strongly preferred, with authorization to work in the U.S.