Microelectronics Wire Bonder Level 2 (17926-1)-1 Position Available In Middlesex, Massachusetts

Microelectronics Wire Bonder Level 2 (17926-1

• 1 PSCI
• 4.7 Chelmsford, MA Job Details Full-time | Contract $26
• $28 an hour 6 hours ago Qualifications Secret Clearance Mid-level High school diploma or GED Data entry Computer skills IPC-610 Certification Full Job Description 17926-1 Microelectronics Wire Bonder Level 2, Chelmsford, MA (Interim Secret)

DESCRIPTION

Microelectronics Wire Bonder Seeking a Microelectronics Wire Bonder for a leading technology company in Chelmsford, MA. This is an exciting contract opportunity with potential for long-term employment. If you have a keen eye for detail and have an interest in working with electronics, this is a great opportunity to grow in a hands-on role. In this role, you’ll play a key part in fabricating and modifying complex micro-circuit modules using wire and ribbon bonding techniques.

Job Details:

Shift:

First Shift, Full-Time (M-TH) 6:00 AM

• 4:30 PM

Starting Salary:

$26.00

• $28.00/hour

Hours:

6:00 AM

• 4:30 PM Monday through Thursday, with possibility for

Overtime What You’ll Do:

• Fabricates microelectronic components and sub-assemblies by following specific instructions for wire and ribbon bonding utilizing various manual and automatic bonding machines.
• Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.
• Read and interpret assembly process/work instructions and work instruction processes.
• Work with microscopic to large components that may require visual magnification for entire shift.
• Use various hand tools (such as tweezers, rulers, and cutters) and pneumatic tools (such as torque drivers, and screwdrivers).
• Maintain accurate data entry related to production processes.
• Collaborate with teams members to improve throughput and continuous improvement.
• Must be US Citizen
• Active Secret Clearance or Interim Secret Clearance
• 4/10 Work Week
• 1st Shift
• $26.00-28.00/hr.

Duration:

6/2/2025-12/2/2025

• Non-Exempt
• Contract Position
• Worker will work Onsite Full Time

MANDATORY

• Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.
• Familiarity with manual bonding equipment and with automatic bonding equipment.
• Basic computer skills required, including ability to navigate digital systems for timekeeping, work instructions, and task confirmation.
• Strong attention to detail and ability to work in a fast-paced environment.
• Ability to follow written and verbal instructions.
• Ability to learn J-STD-001 and/or

IPC-A-610.

• Knowledge of ESD procedures and test equipment.
• Strong work ethic and a reputation for punctuality and reliability, with a desire to grow and learn in their role.
• High school diploma or GED required. DESIRED

N/A Job Types:

Full-time, Contract Pay:

$26.00

• $28.

00 per hour

Schedule:

10 hour shift

Work Location:

In person