Die Attach Operator Position Available In Hillsborough, New Hampshire
Tallo's Job Summary: The Die Attach Operator position requires a High School diploma and at least 2 years of experience in microelectronics module assembly. Responsibilities include operating and setting up manual gold wire bonders and die attach systems. The job pays at a competitive rate and is well-suited for individuals with a strong attention to detail in a cleanroom environment.
Job Description
Seeking an experienced Assembly Operator to handle delicate die and microelectronic production equipment within a cleanroom environment.
Requirements:
High School diploma required Minimum of 2 years’ experience in microelectronics module assembly Ability to set up, operate, and adjust microelectronic production equipment Knowledge of wire-bonding gold wire or ribbon to various dies and substrates Experience with die attach using solder preforms or epoxy Adherence to all area ESD protocols Good manual dexterity for handling delicate components Familiarity with working in a cleanroom environment, including wearing smocks, masks, and gloves
Preferred Skills:
Experience with a Datacon machine for epoxy die attach
Job Responsibilities:
Operate and set up manual gold wire bonders and eutectic/epoxy die attach systems according to micro-circuit layout drawings Ensure proper wire formation, bond appearance, and bond strength in compliance with Mil Std 883 Responsible for proper die attachment, including coverage and die shear strength per Mil Std 883 Work under direction from production schedules, manufacturing procedures, and process plans Maintain significant attention to detail for production activities and documentation to uphold Mil Standard 883 requirements Flexibility to train in multiple microelectronics processes and perform other assembly activities
